Lavina 30 Grit Double Round Metal Bond Diamond Grinding Plate

Lavina-compatible metal bond diamond grinding plate with two round segments and a 3-hole mounting plate. Designed for concrete and terrazzo floor grinding, surface preparation and leveling.

  • Double round diamond segments
  • Metal bond
  • 30# grit
  • 3-hole mounting plate
  • For Lavina floor grinders

Lavina Double Round Metal Bond Diamond Grinding Plate

This Lavina-compatible metal bond diamond grinding plate is designed for concrete and terrazzo floor grinding, surface preparation and leveling. The plate features two round diamond segments mounted on a three-hole metal base, providing a balanced grinding pattern for compatible Lavina floor grinder systems.

The 30 grit configuration is suitable for initial and intermediate concrete grinding where controlled material removal and surface preparation are required. The double round segment design provides a relatively smooth scratch pattern compared with rectangular bar segments, making it suitable for preparing concrete surfaces before further refining and polishing.

Applications

  • Concrete floor grinding
  • Concrete surface preparation
  • Concrete leveling
  • Terrazzo floor grinding
  • Floor renovation
  • Surface preparation before polishing
  • Industrial and commercial floor applications

Product Features

  • Metal bond diamond grinding plate
  • Double round diamond segments
  • 30# grit
  • Three-hole mounting plate
  • Designed for compatible Lavina floor grinders
  • Suitable for concrete and terrazzo
  • Different grits and bond specifications can be supplied
Bond

Metal Bond

Grit

30#

Segment Shape

Double Round

Mounting

3-Hole/ Lavina

Tool type

Metal Bond Diamond Grinding Plate

Application

Concrete Grinding, Concrete Surface Preparation, Terrazzo Grinding

Compatible Machine

Lavina Floor Grinders

OEM

Avalible

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